Black or White HASL Aluminum PCB Board / MCPCB for Amplifier and Power Controller

Black or White HASL Aluminum PCB Board / MCPCB for Amplifier and Power Controller

Capability

Single Layer Metal Core PCB

A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.

The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.

The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.

Double Layers Metal Core PCB

Double layers MCPCB is consisting of two layers of copper conductor, put them on same side of metal core (usually aluminum, copper or iron alloy). The metal base is on the bottom of whole MCPCB, which is different from double sided MCPCB(the two copper layers were put on the each side of metal core respectively), and you can only populate SMD on top side.

Different with Single layer MCPCB, 2 layers MCPCB requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together.

Compared with normal FR4, this sturcture need more technology and experience on laminating of two layers together with metal core.

The processing steps of the MCPCB with the metal base embedded in the PCB are comparatively complex as hole plugging is required after primary drilling on the metal base in order to isolate it from the circuitry.

Double Sided Metal Core PCB

It also has same two layers of copper conductor like Double layers MCPCB, but the metal core is in the middle of two conductor, so there\'re conductors (trace) on both sides of metal core, and were connected to each other by Vias. So we named it \"Double sided MCPCB\", and you can populated SMD on both top and bottom.

Different with Single layer MCPCB, double sided MCPCB also requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together. But sometimes, some raw Metal Clad material vendor will supply board material which already laminated.

Compared with normal FR4, this sturcture need more technology and experience on laminating of two layers together with metal core.

Multi Layers Metal Core PCB

Just like FR4 PCB, we can also make boards with more than 2 layers of traces and we named it \"Multi Layers MCPCB\". The structure is similar with FR4 Multi Layers, but it much more complex to make.

You can populated more components on the boards, put signal and ground layer into seperated layers, to achieve better performance in electrical performance.

Compared with normal FR4, this sturcture need more technology and experience on laminating of more than two layers together with metal core and the cost is much higher than 2 layers MCPCBor double sided MCPCB.

Application of MCPCB

LED lights: High-current LED, Spotlight, high-current PCB

Industrial power equipment: High-power transistors, transistor arrays, push-pull or totem pole output circuit (to tem pole), solid-state relay, pulse motor driver, the engine Computing amplifiers (Operational amplifier for serro-motor), pole-changing device (Inverter)

Cars: firing implement, power regulator, exchange converters, power controllers, variable optical system

Power: voltage regulator series, switching regulator, DC-DC converters

OA: Printer driver, large electronic display substrate, thermal print head

Audio: input - output amplifier, balanced amplifier, pre-shield amplifier, audio amplifier, power amplifier

Others: Semiconductor thermal insulation board, IC arrays, resistor arrays, Ics carrier chip, heat sink, solar cell substrates, semicond